SINGAPORE, March 20 Following are terms and conditions of a bond to be issued on April 01, 2009
Borrower Singapore Government
Issue Amount S$800 Million
Issue Code NX04100F
Coupon 3.625 pct
Issue Date April 01, 2009
Maturity Date July 01 , 2014
Issue yield and price To be determined at auction
Coupon Payment Dates 01 July and 01 January
Next Coupon Payment Date 01 July 2009
Auction Date March 27, 2009
Method of Sale Uniform-Price Auction
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