SINGAPORE, February 18 Following are terms and conditions of a bond to be issued on March 02, 2009
Borrower Singapore Government
Issue Amount S$700 Million
Issue Code NZ07100S
Coupon 3.5 pct
Issue Date March 02, 2009
Maturity Date March 01, 2027
Issue yield and price To be determined at auction
Coupon Payment Dates 01 September and 01 March
Next Coupon Payment Date 01 September 2009
Auction Date February 25, 2009
Method of Sale Uniform-Price Auction
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