Singapore company Red Micro Wire Pte. Ltd (RMW) has developed a breakthrough technology for the semiconductor bonding wire process. According to RMW, the technology provides a cost-effective and highly scalable alternative to current solutions.
Unlike traditional wires, RMW's wires are cast, not drawn. The process produces a high strength, ultra-fine glass coating surrounding a soft metal core and able to scale down to 4 microns, far smaller than the 16-14 microns current wire can scale. Full story
