Yahoo Asia News, 20 Jun 2009, Reuters
SINGAPORE, June 19 Following are terms and conditions of a bond to be issued on July 01, 2009:
Borrower Singapore Government
Issue Amount S$2200 Million
Issue Code NX01100H
Coupon 3.625 pct
Issue Date July 01, 2009
Maturity Date July 01, 2011
Issue yield and price To be determined at auction
Coupon Payment Dates 01 July and 01 January
Next Coupon Payment Date 01 January 2009
Auction Date June 26, 2009
Method of Sale Uniform-Price Auction
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